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TPC8401 TOSHIBA Field Effect Transistor Silicon N, P Channel MOS Type (U-MOSII) TPC8401 Lithium Ion Secondary Battery Applications Portable Equipment Applications Notebook PCs Low drain-source ON resistance : P Channel RDS (ON) = 27 m (typ.) N Channel RDS (ON) = 14 m (typ.) High forward transfer admittance : P Channel |Yfs| = 7 S (typ.) N Channel |Yfs| = 8 S (typ.) Low leakage current : P Channel IDSS = -10 A (VDS = -30 V) N Channel IDSS = 10 A (VDS = 30 V) Enhancement-mode : P Channel Vth = -0.8~ -2.0 V (VDS = -10 V, ID = -1mA) N Channel Vth = 0.8~2.5 V (VDS = 10 V, ID = 1mA) Unit: mm Maximum Ratings (Ta = 25C) Characteristics Drain-source voltage Drain-gate voltage (RGS = 20 k) Gate-source voltage Drain current DC Pulse (Note 1) (Note 1) Symbol VDSS VDGR VGSS ID IDP PD (1) PD (2) PD (1) PD (2) EAS IAR EAR Tch Tstg Rating P Channel N Channel -30 -30 20 -4.5 -18 1.5 1.0 0.75 0.45 26.3 (Note 4a) -4.5 0.10 150 -55~150 30 30 20 6 24 1.5 1.0 W 0.75 0.45 46.8 (Note 4b) 6 mJ A mJ C C Unit JEDEC V V V A 2-6J1E JEITA TOSHIBA Weight: 0.080 g (typ.) Drain power Single-device operation (Note 3a) dissipation (t = 10s) Single-device value at (Note 2a) dual operation (Note 3b) Drain power Single-device operation (Note 3a) dissipation (t = 10s) Single-device value at (Note 2b) dual operation (Note 3b) Single pulse avalanche energy Avalanche current Repetitive avalanche energy Single-device value at operation (Note 2a, 3b, 5) Channel temperature Storage temperature range Circuit Configuration Note: For (Note 1), (Note 2a), (Note 2b), (Note 3a), (Note 3b), (Note 4a), (Note 4b) and (Note 5), please refer to the next page. This transistor is an electrostatic sensitive device. Please handle with caution. 1 2002-05-17 TPC8401 Thermal Characteristics Characteristics Single-device operation (Note 3a) Symbol Rth (ch-a) (1) Rth (ch-a) (2) Rth (ch-a) (1) Rth (ch-a) (2) Max 83.3 Unit Thermal resistance, channel to ambient (t = 10s) (Note 2a) Single-device value at dual operation (Note 3b) Single-device operation (Note 3a) 125 C/W 167 Thermal resistance, channel to ambient (t = 10s) (Note 2b) Single-device value at dual operation (Note 3b) 278 Marking TPC8401 * Type Note 1: Please use devices on condition that the channel temperature is below 150C. Note 2: a) Device mounted on a glass-epoxy board (a) FR-4 25.4 x 25.4 x 0.8 (unit: mm) b) Device mounted on a glass-epoxy board (b) FR-4 25.4 x 25.4 x 0.8 (unit: mm) (a) (b) Note 3: a) The power dissipation and thermal resistance values are shown for a single device (During single-device operation, power is only applied to one device.) b) The power dissipation and thermal resistance values are shown for a single device (During dual operation, power is evenly applied to both devices.) Note 4: a) VDD = -24 V, Tch = 25C (Initial), L = 1.0 mH, RG = 25 , IAR = -4.5 A b) VDD = 24 V, Tch = 25C (Initial), L = 1.0 mH, RG = 25 , IAR = 6.0 A Note 5: Repetitive rating: pulse width limited by maximum channel temperature Note 6: * on lower left of the marking indicates Pin 1. * shows lot number. (year of manufacture: last decimal digit of the year of manufacture, month of manufacture: January to December are denoted by letters A to L respectively.) 2 2002-05-17 TPC8401 P-ch Electrical Characteristics (Ta = 25C) Characteristics Gate leakage current Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-ON time Switching time Fall time tf toff Qg Qgs1 Qgd VDD -24 V, VGS = -10 V, ID = -4.5 A -- 75 -- Symbol IGSS IDSS V (BR) DSS V (BR) DSX Vth RDS (ON) RDS (ON) |Yfs| Ciss Crss Coss tr ton VDS = -10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = 16 V, VDS = 0 V VDS = -30 V, VGS = 0 V ID = -10 mA, VGS = 0 V ID = -10 mA, VGS = 20 V VDS = -10 V, ID = -1 mA VGS = -4 V, ID = -2.2 A VGS = -10 V, ID = -2.2 A VDS = -10 V, ID = -2.2 A Min -- -- -30 -15 -0.8 -- -- 3.5 -- -- -- -- -- Typ. -- -- -- -- -- 51 25 7 970 180 370 17 20 Max 10 -10 -- -- -2.0 65 35 -- -- -- -- -- -- ns pF Unit A A V V m S Turn-OFF time Total gate charge (Gate-source plus gate-drain) Gate-source charge 1 Gate-drain ("miller") charge -- -- -- -- 160 28 6 12 -- -- -- -- nC Source-Drain Ratings and Characteristics (Ta = 25C) Characteristics Drain reverse current Pulse (Note 1) Symbol IDRP VDSF Test Condition -- IDR = -4.5 A, VGS = 0 V Min -- -- Typ. -- -- Max -18 1.2 Unit A V Forward voltage (diode) 3 2002-05-17 TPC8401 N-ch Electrical Characteristics (Ta = 25C) Characteristics Gate leakage current Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Symbol IGSS IDSS V (BR) DSS V (BR) DSX Vth RDS (ON) RDS (ON) |Yfs| Ciss Crss Coss tr ton tf toff Qg Qgs1 Qgd VDD 24 V, VGS = 10 V, ID = 6 A VDS = 10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = 16 V, VDS = 0 V VDS = 30 V, VGS = 0 V ID = 10 mA, VGS = 0 V ID = 10 mA, VGS = -20 V VDS = 10 V, ID = 1 mA VGS = 4 V, ID = 3 A VGS = 10 V, ID = 3 A VDS = 10 V, ID = 3 A Min 30 15 0.8 4 Typ. 21 14 8 1700 260 380 10 Max 10 10 2.5 32 21 pF Unit A A V V m S Turn-ON time Switching time Fall time 20 ns 35 Turn-OFF time Total gate charge (Gate-source plus gate-drain) Gate-source charge 1 Gate-drain ("miller") charge 120 40 28 12 nC Source-Drain Ratings and Characteristics (Ta = 25C) Characteristics Drain reverse current Pulse (Note 1) Symbol IDRP VDSF IDR = 6 A, VGS = 0 V Test Condition -- Min -- -- Typ. -- -- Max 24 -1.2 Unit A V Forward voltage (diode) 4 2002-05-17 TPC8401 P-ch PD - Ta (W) 2.0 DEVICE MOUNTED ON A GLASS-EPOXY BOARD (a) (NOTE 2a) (1) SINGLE-DEVICE OPERATION (NOTE 3a) (2) SINGLE-DEVICE VALUE AT DUAL OPERATION (NOTE 3b) DEVICE MOUNTED ON A GLASS-EPOXY BOARD (b) (NOTE 2b) (3) SINGLE-DEVICE OPERATION (NOTE 3a) (4) SINGLE-DEVICE VALUE AT DUAL OPERATION (NOTE 3b) t = 10 s DRAIN POWER DISSIPATION PD 1.5 (1) (2) 1.0 (3) 0.5 (4) 0 0 50 100 150 200 AMBIENT TEMPERATURE Ta (C) 5 2002-05-17 TPC8401 P-ch PD - Ta (W) 2.0 DEVICE MOUNTED ON A GLASS-EPOXY BOARD (a) (NOTE 2a) (1) SINGLE-DEVICE OPERATION (NOTE 3a) (2) SINGLE-DEVICE VALUE AT DUAL OPERATION (NOTE 3b) DEVICE MOUNTED ON A GLASS-EPOXY BOARD (b) (NOTE 2b) (3) SINGLE-DEVICE OPERATION (NOTE 3a) (4) SINGLE-DEVICE VALUE AT DUAL OPERATION (NOTE 3b) t = 10 s DRAIN POWER DISSIPATION PD 1.5 (1) (2) 1.0 (3) 0.5 (4) 0 0 50 100 150 200 AMBIENT TEMPERATURE Ta (C) 6 2002-05-17 TPC8401 P-ch 7 2002-05-17 TPC8401 N-ch 8 2002-05-17 TPC8401 N-ch PD - Ta (W) 2.0 DEVICE MOUNTED ON A GLASS-EPOXY BOARD (a) (NOTE 2a) (1) SINGLE-DEVICE OPERATION (NOTE 3a) (2) SINGLE-DEVICE VALUE AT DUAL OPERATION (NOTE 3b) DEVICE MOUNTED ON A GLASS-EPOXY BOARD (b) (NOTE 2b) (3) SINGLE-DEVICE OPERATION (NOTE 3a) (4) SINGLE-DEVICE VALUE AT DUAL OPERATION (NOTE 3b) t = 10 s DRAIN POWER DISSIPATION PD 1.5 (1) (2) 1.0 (3) 0.5 (4) 0 0 50 100 150 200 AMBIENT TEMPERATURE Ta (C) 9 2002-05-17 TPC8401 N-ch 10 2002-05-17 TPC8401 RESTRICTIONS ON PRODUCT USE 000707EAA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 11 2002-05-17 |
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